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| TOPPAN PRINTING CO.,LTD. |
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| Commitment to SiP Solutions |
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TOPPAN has been involved in the design and manufacture of electronic components and device,
including the semiconductors and displays that are essential to multifunction electronic devices.
In SiP business
TOPPAN has developed the new multi-layer tape substrate for semiconductor, package, fine filled via-hole formation,
fine pattern formation, and laminating process technology consist the key technologies used. The features of
this
substrate are high speed transmission, high density, high reliability and ultra thin package. We hope to further
extend this technology into these business.
TOPPAN has provided the new multi-layer tape substrate and technical supports (precise circuit design , various
simulation technologies, etc.) to resolve various problems. |
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| TOPPAN Multi-layer Tape Substrate |
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 Substrate features
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High speed transmission and high density |
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S-parameter 4.5GHz ( S21= -1.0dB , length 20mm ) |
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L/S=20/20um, Via/Land=40/90um |
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Reel-to-reel process |
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It is easy to control insulating layer thickness. |
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Fluid control is easy, plating and etching uniformity is good. |
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Applications
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FC-BGA |
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Substrate for SiP |
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Package needed to high speed |
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Structure (4-layer Standard Model)
Specifications
150um Pad pitch |
| Subjects |
Specifications |
| Tape Material |
Polyimide |
| Dielectric Constant |
3.3-3.4 |
| Number of Layers |
4 |
| Total Thickness |
150um |
| Line/Space |
min.20/20um |
| Via/Land Diameter |
min.40/90um |
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stacked Via |
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| Technology and Catalogue |
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| Title |
Technology
and Catalogue |
| TOPPAN Multi-layer Tape Substrate |
PDF(172KB) |
| ELECTRONICS DEVISION |
PDF(3.3MB) |
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 TOPPAN
PRINTING CO.,LTD. |
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| About details and other products, and technology, I am introducing in official
site of our company. Please unite and have a look |
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