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| TANAKA DENSHI KOGYO K.K. |
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| Commitment to SiP Solutions |
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1. Effort toward SiP solution
In recent years, the shift toward a system LSI technology has been accelerated due to high demand of multi-functionalization of electronic devices. Especially SiP is one of the most promising technologies because of shorter design time and lower cost. Above all, 3 dimensional chip stacked package is widely adopted. In the 3D chip stacked package assembly, the wire bonding technology is widely used because of its flexibility
We have been developing new material and assembly technology with aiming at requirements for SiP such as capability on various loop formation and bond reliability against increasing temperature by device operation. We have been providing the high quality bonding wire into market base on cultivate technology and experience for many years. |
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| SiP related products |
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2. Introduction of product regarding with SiP assembly
In the assembly of chip stacked SiP, the capability of various loop shape is needed because the different loop shape are required for under chip and upper chip. GMH-2 and GLF with 4N purity gold has been developed and introduced into market. On the other hand, the bond reliability between Au ball and Al pad should be severe because of the generation of heat by gathering multiple chip in a package. Au alloy bonding wire "GPG" has been developed and widely used in the market as one of the solution on this bond reliability issue. |
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| Technology and Catalogue |
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 TANAKA DENSHI KOGYO K.K. |
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| About details and other products, and technology,
I am introducing in official site of our company. Please unite
and have a look |
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