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| SUMITOMO BAKELITE CO., LTD. |
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| Commitment to SiP Solutions |
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"SiP? SoC? Which will be a mainstream?" Answer of Sumitomo Bakelite for this question is "Both of them. We proudly deliver the suited material for both technologies".
Currently, many devices like a Cellular Phone, PDA, DSC, DVC, etc.., cannot be developed without SiP. Business on this field is very tough due to very sever requirement from customer. (Minimum size, but Maximum function).
The requirement from customer, makes T.A.T be shorter and shorter.
We support I.T business by whole range material line up for SiP.
And, we always try to develop the optimized material for market needs, with our concept "FUSION" as shown below.
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Fusion on Information Sharing
Seamless information sharing between R&D, Sales, and Customer. |
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Fusion on Current Materials
We provide a solution with combination of our current materials. |
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Fusion on R&D
R&D resources are combined for Short T.A.T |
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Fusion on Future Material
Knowledge and Know How gathered while the activities shown above, support future material development. |
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| SiP related products |
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 LSI/Assembly
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| Coating resins for semiconductor wafers
SUMIRESIN EXCELR®CRC |
Epoxy resin molding compounds for
encapsulation of semiconductor devices SUMIKONR® EME |
Liquid epoxy resins for encapsulation
of semiconductor devices SUMIRESIN EXCELR®CRP |
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| Pastes for die bonding SUMIRESIN EXCELR®CRM |
Adhesive tapes for assembling semiconductors
SUMILITER®IBF |
Dicing tapes SUMILITER®FSL |
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| Co-extruded multilayered films and
sheets for industrial uses SUMILITER®CEL |
Epoxy resin coating powder for electrical
insulation SUMILITE RESINR®ECP |
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| Liquid epoxy resins for electric & electronic
components |
Phenolic resins |
| SUMIMACRECR®/ECH |
SUMILITE RESINR® PR |
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| Precision
molded products |
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| JISSO |
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| Flexible printed circuit boards
SUMILITER®TFP |
Epoxy resin multilayer PWB materials
SUMILITER®ELC |
Carrier tapes for mounting semiconductors
& electronic components SUMICARRIERR® and Cover tapes
SUMILITER®CSL |
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| Reactive liquid resins for soldering
interconnection SBJET |
Engineering plastics molding compounds
SUMIKONR®FM |
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| Technology and Catalogue |
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| One Component Liquid Epoxy Resin Composition “SUMIMAC” ECR-8000 Series For Secondary Underfill ECR-ECR-8015TO/8002K |
| One Component Liquid Epoxy Resin Composition “SUMIMAC” ECR-9000 Series For Secondary Underfill ECR-9945K |
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 SUMITOMO BAKELITE CO., LTD. |
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| About details and other products, and
technology, I am introducing in official site of our company.
Please unite and have a look |
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