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| Shinkawa Ltd. |
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| Commitment to SiP Solutions |
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As manufacturer providing total bonding solution, SHINKAWA Ltd. have contributed to production of semiconductor devices through development of various assembly technologies along with advances in semiconductor packaging.
With diversified bonding techniques required in SiP, our mainstream die mounting and wire bonding equipment are designed to accommodate needs for multi-layer stacked applications and ever slimming of chips.
We support stable production of continually advancing SiP devices by challenging new issues with our rich experiences and cutting edge technology. |
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| SiP related products |
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 Die Bonder SPA-300
Capable of handling multi-layer stacked devices which require versatility in die bonding (i.e. epoxy, DAF, tape attaching, flip bonding).
Applicable to latest slim packages with implementation of ultra-thin wafer handling system.
Wire Bonder UTC-1000
Capable of accommodating different applications including fine pitch devices and SiP devices with our innovative bonding technology. Wide selection of looping modes allow required loop for multi-layer stacked devices. |
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 Shinkawa Ltd. |
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| About details and other products, and technology,
I am introducing in official site of our company. Please unite
and have a look |
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