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| Nippon Steel Corporation |
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| Commitment to SiP Solutions |
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| The NSC Group has come up with "Material Solutions," which uses the group's material development and product designing capabilities acquired in the steel production business and related operations to meet users' varied needs. With "Material Solutions," the NSC Group hopes to contribute to the development of "System-in-package," which is a high-density packaging technology indispensable for the current trend of mobile and multimedia devices that are smaller, have more functions, and are higher performance. |
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| SiP related products |
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| The NSC Group offers the following products for high-density packaging: |
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Bonding wire products such as high-strength thin line bonding wire for narrow pitches and low-flexion bonding wire for stacked packages |
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Lead-free solder balls that have excellent thermal-fatigue resistance and drop-impact strength |
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Micro ball bumping technology that can form about 600,000 bumps on an 8-inch wafer at a time |
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Flip-chip bonding paste products that allow packaging to be completed in a few seconds |
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High-resolution photosensitive film products for solder resist |
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Epoxy sheet products with low linear expansivity, high elongation, and high workability |
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| Technology and Catalogue |
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| Title |
Technology and Catalogue |
| Bonding Wire and Micro Ball of Nippon Steel Materials |
PDF(118KB) |
| Microball Bumping Technology of Nippon Steel Materials |
PDF(47KB) |
| Semiconductor Packaging Materials Manufactured by Nippon Steel Chemical |
PDF(32KB) |
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