 |
|
|
|
| LINTEC Corporation |
|
 |
| Commitment to SiP Solutions |
|
Spurred by rapid growth among mobile phones and other compact electronics
devices, production of thinner semiconductor chips has accelerated
for high density, ultra-thin electronics devices, as represented by
the 3D package. We are proud to be heavily involved in the development
of SiP technology through the integration our adhesive and processing
technologies.
We provide semiconductor manufacturers with our highly advanced products
like a die bonding tape (LE tape) to free them from the constraints of conventional
process. We also develop solutions to establish reliable production processes
for much larger and thinner wafers. |
| |
| SiP related products |
|
| The highly advanced Adwill L-series tape (insulation
type) serves as both dicing tape and die bonding tape. Adhesive
can be evenly transferred to the entire rear surface of the
wafer, eliminating bleeding or displacement of adhesive during
pickup. Accordingly, this tape is ideal for die bonding ultra-thin
stacked CSP products, etc., greatly improving product reliability.
This dual purpose tape also simplifies processing, from dicing
to bonding. |
|
 |
| |
| Technology and Catalogue |
|
| Title |
Technology and
Catalogue |
| Die bonding tape - Adwill L-series |
PDF(104KB) |
| Fully-Automatic Wafer
Multi-Mounting System - RAD-2500F/12-MUL |
PDF(54KB) |
| Equipment and products for DBG process |
PDF(31.5KB) |
|
|
| |
 |
 LINTEC
Corporation |
 |
| About details and other products, and technology,
I am introducing in official site of our company. Please unite
and have a look |
|
|
| |
|
|
|
|
