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| IBIDEN Co.,Ltd. |
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| Commitment to SiP Solutions |
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IBIDEN is offering all processes from designing through manufacturing of SiP substrates. Our specialty is mass production of build-up substrates, ultra thin substrates and SiP substrates which require high technology for fine patterned board. The principal use of substrates is a package for small (below 10 sq. mm) and high performance LSI installed in mobile equipments (cellular phone, digital camera, PDA etc.). |
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IBITECH bears the design section of IBIDEN, and offers all processes from design planning through assembly and prototype evaluation for low and mid-volume products. It also handles design of substrates which considers high-speed transmission and electric characteristic, SiP/Module with embedded passives, and a package with special substrates and structure. |
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| SiP related products |
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Two layered and four layered thin substrates(IBIDEN)
For substrates with restricted total thickness |
| (1)Two layered thin core substrates |
(2)Four layered thin core substrates |
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Cavity module(IBITECH)
Ultimate package with perfect thickness control |
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NHCC(IBITECH)
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NHCC:Non Hole Chip Carrier) Clears problems of LCC/CSP package. No burr; narrow pitch possible; better in mounting, inspection and repair. Enables patterning at the edge of board. |
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Please visit our web site for other products and technologies. |
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| Technology and Catalogue |
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