 |
|
|
|
| Hitachi Chemical Co.,Ltd. |
|
 |
| Commitment to SiP Solutions |
|
Hitachi Chemical has been offering successively the Material System
Solution (MSS) for semiconductor related devices by fully utilizing
the latest versatile technologies, which have been cultivated in the
production processes of device construction, process technology, manufacturing
systems and materials, and by adequately communicating with customers.
Recently, SiPs have been diversified into 3D-structures. In these
structures, many kinds of materials and various characteristics are
simultaneously required. In order to produce the highly reliable SiPs,
it is much more important for Hitachi Chemical to provide our customers
with materials considering total SiP itself such as the best material
combination.
Hitachi Chemical has many kinds of materials and technologies related
to semiconductor devices and printed wiring boards; which are indispensable
for SiPs. Utilizing these materials and technologies, Hitachi Chemical
is implementing MSS strongly to our customers to make their SiPs
more
valuable. |
|
 |
| |
| SiP related products |
|
Hitachi Chemical provides many kinds of Semiconductor-Related Materials,
Base Materials for PWBs and Printed Wiring Boards in our products,
especially SiPs related material such as Die Bonding Materials, Encapsulation
Materials, High Tg Multilayer Material, Package Substrate.
Semiconductor-Related
Materials
- Die Bonding Materials
- Encapsulation Materials
- Junction Coating Materials
Base
Materials for PWBs
- High Tg Glass-Epoxy Multilayer Material
- Adhesive film for PWB
Printed
Wiring Boards
- Package Substrate
- P WB for Testing |
| |
| Technology and Catalogue |
|
| If you require any further technical information and a catalogue,
please utilize "inquiry" on SiP-related products through
our official Web Site listed below. |
| |
|
|
|
|
