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| DISCO CORPORATION |
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| Commitment to SiP Solutions |
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| DISCO's specialty lies in the highly advanced technologies of Kiru
(cutting) Kezuru (grinding) and Migaku (polishing). Based on this
technology, we provide solutions for SiP (System in Package) such as MCP (Multi Chip Package), PTP (Paper Thin Package). |
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Kiru
Dicing saw is a machine that uses a rotating
ultra thin diamond blade for dicing workpiece, such as Thinned
wafer and DAF (Die Attach Film) attached wafer. |
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Kezuru
Grinding machines use a rotating diamond impregnated
wheel, to thin, polish or planarize materials by back grinding
process. This machine is also used for chip thinning process
with DBG (Dicing Before Grinding), and WSS (Wafer Support System)
to safely transfer thinned wafer. |
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Migaku
Polisher uses a dry polishing process for stress
relief, which removes the mechanical damage caused by backside
grinding. |
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| SiP related products |
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| Dicing
saw |
8-inch wafer supporting Fully automatic dicing
saw |
[DFD6340] |
| 300-mm wafer supporting
Fully automatic dicing saw |
[DFD6361] |
| Grinder |
8-inch wafer supporting Fully automatic grinder |
[DFG8540] |
| 300-mm wafer supporting
Fully automatic grinder |
[DFG8560] |
| Polisher |
8-inch wafer supporting Fully automatic polisher |
[DFP8140] |
| 300-mm wafer supporting
Fully automatic polisher |
[DFP8160] |
Precision diamond
blades and wheels |
Disco's Dicing blades, Grinding
wheels and Dry polishing wheels provide highly accurate
Kiru (cutting), Kezuru (grinding) and Migaku (polishing)
technologies |
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| Disco's wide variety of product line-up together
with application for optimum processing condition and services, will
provide total solution for SiP production that meets your processing
needs. Please contact our Sales representatives for details. |
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| Technology and Catalogue |
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Download catalogues for Dicing
saw, Grinder and polishers from here
Download catalogues for Diamond precision blade
& wheel from here |
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DISCO
CORPORATION |
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| For product and technological details,
please see our official web site. |
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