SiP Consortium
Current Members
The SiP (System in Package) Consortium is engaged in the development of semiconductor packaging technologies based on 3-dimensional, ultra-small, and high-density packaging. ???HOME
About SiP Consortium
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Participating Company
DISCO CORPORATION
DISCO CORPORATION
Commitment to SiP Solutions
DISCO's specialty lies in the highly advanced technologies of Kiru (cutting) Kezuru (grinding) and Migaku (polishing). Based on this technology, we provide solutions for SiP (System in Package) such as MCP (Multi Chip Package), PTP (Paper Thin Package).
 
Kiru
Dicing saw is a machine that uses a rotating ultra thin diamond blade for dicing workpiece, such as Thinned wafer and DAF (Die Attach Film) attached wafer.
 
   
Kezuru
Grinding machines use a rotating diamond impregnated wheel, to thin, polish or planarize materials by back grinding process. This machine is also used for chip thinning process with DBG (Dicing Before Grinding), and WSS (Wafer Support System) to safely transfer thinned wafer.
 
     
Migaku
Polisher uses a dry polishing process for stress relief, which removes the mechanical damage caused by backside grinding.
 
 
SiP related products
Dicing saw 8-inch wafer supporting Fully automatic dicing saw [DFD6340]
300-mm wafer supporting Fully automatic dicing saw [DFD6361]
Grinder 8-inch wafer supporting Fully automatic grinder [DFG8540]
300-mm wafer supporting Fully automatic grinder [DFG8560]
Polisher 8-inch wafer supporting Fully automatic polisher [DFP8140]
300-mm wafer supporting Fully automatic polisher [DFP8160]
Precision diamond
blades and wheels
Disco's Dicing blades, Grinding wheels and Dry polishing wheels provide highly accurate Kiru (cutting), Kezuru (grinding) and Migaku (polishing) technologies
 
Disco's wide variety of product line-up together with application for optimum processing condition and services, will provide total solution for SiP production that meets your processing needs. Please contact our Sales representatives for details.
 
Technology and Catalogue
Download catalogues for Dicing saw, Grinder and polishers from here
Download catalogues for Diamond precision blade & wheel from here
 
Link
DISCO CORPORATION
For product and technological details, please see our official web site.
 
 
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